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Issue DateTitleAuthor(s)
11996Stress testing for product reliability in the year 2000Chan, Anthony Hing-Hung 
21997Reliability considerations from chip to packaging and systemsChan, Anthony Hing-Hung 
31998Product reliability through stress testingChan, Anthony Hing-Hung 
41999Product reliability through stress testingChan, Anthony Hing-Hung 
51996Product reliability and stress testingChan, Anthony Hing-Hung 
61995Product reliability and stress testingChan, Anthony Hing-Hung 
71995Overview of stress testingChan, Anthony Hing-Hung 
81994A formulation to optimize stress testingChan, Anthony Hing-Hung 
91993Component reliability problems: Their origins and manifestationsChan, Anthony Hing-Hung 
101996Surface insulation resistance methodology for today's manufacturing technologyChan, Anthony Hing-Hung 
111994A formulation of product reliability through environmental stress testing and screeningChan, Anthony Hing-Hung 
121994Environmental stress testingChan, Anthony Hing-Hung 
131995The benefits of stress testingChan, Anthony Hing-Hung 
141997Product reliability through stress testingChan, Anthony Hing-Hung 
151994An overview of reliability and stress testing for consumer electronicsChan, Anthony Hing-Hung 
161997Overview of accelerated stress testing principlesChan, Anthony Hing-Hung 
171996Is the current surface insulation resistance (SIR) methodology appropriate to today's manufacturing technology?Chan, Anthony Hing-Hung 
181994A formulation of environmental stress testing and screeningChan, Anthony Hing-Hung 
198-Jan-1991Localized soldering by inductive heatingChan, Anthony Hing-Hung 
201992Product reliability improvement with stress testingChan, Anthony Hing-Hung 
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