Please use this identifier to cite or link to this item:
https://repository.cihe.edu.hk/jspui/handle/cihe/3364| Title: | Reliability considerations from chip to packaging and systems | Author(s): | Chan, Anthony Hing-Hung | Author(s): | El-Kareh, B. | Issue Date: | 1997 | Conference: | The 47th Electronic Components and Technology Conference (ECTC) | URI: | https://repository.cihe.edu.hk/jspui/handle/cihe/3364 | CIHE Affiliated Publication: | No |
| Appears in Collections: | CIS Publication |
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