Please use this identifier to cite or link to this item:
https://repository.cihe.edu.hk/jspui/handle/cihe/3357| Title: | Advanced packaging | Author(s): | Chan, Anthony Hing-Hung | Author(s): | Selvaduray, G. | Issue Date: | 2003 | Conference: | The 4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-systems | URI: | https://repository.cihe.edu.hk/jspui/handle/cihe/3357 | CIHE Affiliated Publication: | No |
| Appears in Collections: | CIS Publication |
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