Please use this identifier to cite or link to this item:
https://repository.cihe.edu.hk/jspui/handle/cihe/3357| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chan, Anthony Hing-Hung | en_US |
| dc.contributor.other | Selvaduray, G. | - |
| dc.date.accessioned | 2022-06-09T09:47:00Z | - |
| dc.date.available | 2022-06-09T09:47:00Z | - |
| dc.date.issued | 2003 | - |
| dc.identifier.uri | https://repository.cihe.edu.hk/jspui/handle/cihe/3357 | - |
| dc.title | Advanced packaging | en_US |
| dc.type | lecture | en_US |
| dc.relation.conference | The 4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-systems | en_US |
| dc.contributor.affiliation | School of Computing and Information Sciences | en_US |
| dc.cihe.affiliated | No | - |
| item.fulltext | No Fulltext | - |
| item.openairetype | lecture | - |
| item.grantfulltext | none | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_8544 | - |
| item.cerifentitytype | Publications | - |
| crisitem.author.dept | Yam Pak Charitable Foundation School of Computing and Information Sciences | - |
| crisitem.author.orcid | 0000-0001-7479-0787 | - |
| Appears in Collections: | CIS Publication | |
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