Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/3357
DC FieldValueLanguage
dc.contributor.authorChan, Anthony Hing-Hungen_US
dc.contributor.otherSelvaduray, G.-
dc.date.accessioned2022-06-09T09:47:00Z-
dc.date.available2022-06-09T09:47:00Z-
dc.date.issued2003-
dc.identifier.urihttps://repository.cihe.edu.hk/jspui/handle/cihe/3357-
dc.titleAdvanced packagingen_US
dc.typelectureen_US
dc.relation.conferenceThe 4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-systemsen_US
dc.contributor.affiliationSchool of Computing and Information Sciencesen_US
dc.cihe.affiliatedNo-
item.cerifentitytypePublications-
item.fulltextNo Fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_8544-
item.grantfulltextnone-
item.openairetypelecture-
crisitem.author.deptYam Pak Charitable Foundation School of Computing and Information Sciences-
crisitem.author.orcid0000-0001-7479-0787-
Appears in Collections:CIS Publication
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