Please use this identifier to cite or link to this item:
https://repository.cihe.edu.hk/jspui/handle/cihe/2939| Title: | Requirements of advanced packaging curriculum | Author(s): | Chan, Anthony Hing-Hung | Author(s): | Selvaduray, G. Becker, J. F. |
Issue Date: | 2003 | Publisher: | IEEE | Related Publication(s): | Proceedings of the 4th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2003) | Start page: | 155 | End page: | 160 | URI: | https://repository.cihe.edu.hk/jspui/handle/cihe/2939 | CIHE Affiliated Publication: | No |
| Appears in Collections: | CIS Publication |
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