1. CIHE Institutional Repository
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  3. CIS Publication
Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/2939
DC FieldValueLanguage
dc.contributor.authorChan, Anthony Hing-Hungen_US
dc.contributor.otherSelvaduray, G.-
dc.contributor.otherBecker, J. F.-
dc.date.accessioned2022-04-06T07:29:49Z-
dc.date.available2022-04-06T07:29:49Z-
dc.date.issued2003-
dc.identifier.urihttps://repository.cihe.edu.hk/jspui/handle/cihe/2939-
dc.publisherIEEEen_US
dc.titleRequirements of advanced packaging curriculumen_US
dc.typeconference proceedingsen_US
dc.relation.publicationProceedings of the 4th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2003)en_US
dc.contributor.affiliationSchool of Computing and Information Sciencesen_US
dc.relation.isbn0780370546en_US
dc.description.startpage155en_US
dc.description.endpage160en_US
dc.cihe.affiliatedNo-
item.openairecristypehttp://purl.org/coar/resource_type/c_5794-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.openairetypeconference proceedings-
item.fulltextNo Fulltext-
crisitem.author.deptSchool of Computing and Information Sciences-
crisitem.author.orcid0000-0001-7479-0787-
Appears in Collections:CIS Publication
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