Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/3391
Title: From electronic packaging to Internet and the engineers
Author(s): Chan, Anthony Hing-Hung 
Issue Date: 2009
Conference: The IEEE Workshop on Accelerated Stress Testing and Reliability (ASTR 2009) 
URI: https://repository.cihe.edu.hk/jspui/handle/cihe/3391
CIHE Affiliated Publication: No
Appears in Collections:CIS Publication

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