Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/2945
DC FieldValueLanguage
dc.contributor.authorChan, Anthony Hing-Hungen_US
dc.date.accessioned2022-04-06T08:38:38Z-
dc.date.available2022-04-06T08:38:38Z-
dc.date.issued1992-
dc.identifier.urihttps://repository.cihe.edu.hk/jspui/handle/cihe/2945-
dc.titleProduct reliability improvement with stress testingen_US
dc.typeconference proceedingsen_US
dc.relation.publicationProceedings of the 11th AT&T Conference on Electronic Testingen_US
dc.contributor.affiliationSchool of Computing and Information Sciencesen_US
dc.description.startpage3.4.1en_US
dc.description.endpage3.4.9en_US
dc.cihe.affiliatedNo-
item.fulltextNo Fulltext-
item.openairetypeconference proceedings-
item.grantfulltextnone-
item.openairecristypehttp://purl.org/coar/resource_type/c_5794-
item.cerifentitytypePublications-
crisitem.author.deptYam Pak Charitable Foundation School of Computing and Information Sciences-
crisitem.author.orcid0000-0001-7479-0787-
Appears in Collections:CIS Publication
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