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Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/3509
DC FieldValueLanguage
dc.contributor.authorChan, Anthony Hing-Hungen_US
dc.contributor.otherOien, M. A.-
dc.date.accessioned2022-06-24T03:30:31Z-
dc.date.available2022-06-24T03:30:31Z-
dc.date.issued1991-01-08-
dc.identifier.urihttps://repository.cihe.edu.hk/jspui/handle/cihe/3509-
dc.descriptionUnited States Patent No.: 4,983,804en_US
dc.description.abstractDisclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.en_US
dc.language.isoenen_US
dc.titleLocalized soldering by inductive heatingen_US
dc.typetechnical documentationen_US
dc.contributor.affiliationSchool of Computing and Information Sciencesen_US
dc.cihe.affiliatedNo-
item.languageiso639-1en-
item.fulltextWith Fulltext-
item.openairetypetechnical documentation-
item.grantfulltextopen-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.cerifentitytypePublications-
crisitem.author.deptYam Pak Charitable Foundation School of Computing and Information Sciences-
crisitem.author.orcid0000-0001-7479-0787-
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