Please use this identifier to cite or link to this item:
https://repository.cihe.edu.hk/jspui/handle/cihe/3219
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Leung, Andrew Yee Tak | en_US |
dc.contributor.other | Su, R. K. L. | - |
dc.date.accessioned | 2022-05-20T02:54:06Z | - |
dc.date.available | 2022-05-20T02:54:06Z | - |
dc.date.issued | 1995 | - |
dc.identifier.uri | https://repository.cihe.edu.hk/jspui/handle/cihe/3219 | - |
dc.description.abstract | We investigate the stress distribution and the variation of the mode I stress intensity factor along a straight three-dimensional (3D) crack by the finite element method. The results are checked against plane strain theory near the mid-crack and against the 3D theory of Zhu at the free surface. Although Zhu's formulation is not perfect and has some typographical errors. The surface stress distribution of his results are in line with the present study by the finite element method. The stress intensity factors at the free surface are found to be much lower than that at the mid-crack. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Elsevier | en_US |
dc.relation.ispartof | Finite Elements in Analysis and Design | en_US |
dc.title | A numerical study of singular stress field of 3D cracks | en_US |
dc.type | journal article | en_US |
dc.identifier.doi | 10.1016/0168-874X(94)00065-N | - |
dc.contributor.affiliation | School of Computing and Information Sciences | en_US |
dc.relation.issn | 0168-874X | en_US |
dc.description.volume | 18 | en_US |
dc.description.issue | 4 | en_US |
dc.description.startpage | 389 | en_US |
dc.description.endpage | 401 | en_US |
dc.cihe.affiliated | No | - |
item.languageiso639-1 | en | - |
item.fulltext | No Fulltext | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Yam Pak Charitable Foundation School of Computing and Information Sciences | - |
Appears in Collections: | CIS Publication |
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