Please use this identifier to cite or link to this item:
https://repository.cihe.edu.hk/jspui/handle/cihe/3124
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Leung, Andrew Yee Tak | en_US |
dc.contributor.other | Su, R. K. L. | - |
dc.date.accessioned | 2022-05-07T09:24:49Z | - |
dc.date.available | 2022-05-07T09:24:49Z | - |
dc.date.issued | 1996 | - |
dc.identifier.uri | https://repository.cihe.edu.hk/jspui/handle/cihe/3124 | - |
dc.description.abstract | In this paper, an analytical solution for the singular stress field near a flat crack which is orthogonal to the free surface is proposed. The singular stress field of a three-dimensional surface crack is obtained by the principle of superposition. The stresses of mode-I surface crack are derived by combining the solution of a three-dimensional crack and a second solution due to a singular traction on the free surface of a semi-infinite body. The closed form solution for the second solution is evaluated and the stress distribution at the free surface of the crack is compared with some existing results that appeared in the literature. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Springer | en_US |
dc.relation.ispartof | International Journal of Fracture | en_US |
dc.title | Analytical solution for mode I crack orthogonal to free surface | en_US |
dc.type | journal article | en_US |
dc.identifier.doi | 10.1007/BF00034031 | - |
dc.contributor.affiliation | School of Computing and Information Sciences | en_US |
dc.relation.issn | 1573-2673 | en_US |
dc.description.volume | 76 | en_US |
dc.description.issue | 1 | en_US |
dc.description.startpage | 79 | en_US |
dc.description.endpage | 95 | en_US |
dc.cihe.affiliated | No | - |
item.languageiso639-1 | en | - |
item.fulltext | No Fulltext | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Yam Pak Charitable Foundation School of Computing and Information Sciences | - |
Appears in Collections: | CIS Publication |
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