Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/3124
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dc.contributor.authorLeung, Andrew Yee Taken_US
dc.contributor.otherSu, R. K. L.-
dc.date.accessioned2022-05-07T09:24:49Z-
dc.date.available2022-05-07T09:24:49Z-
dc.date.issued1996-
dc.identifier.urihttps://repository.cihe.edu.hk/jspui/handle/cihe/3124-
dc.description.abstractIn this paper, an analytical solution for the singular stress field near a flat crack which is orthogonal to the free surface is proposed. The singular stress field of a three-dimensional surface crack is obtained by the principle of superposition. The stresses of mode-I surface crack are derived by combining the solution of a three-dimensional crack and a second solution due to a singular traction on the free surface of a semi-infinite body. The closed form solution for the second solution is evaluated and the stress distribution at the free surface of the crack is compared with some existing results that appeared in the literature.en_US
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.relation.ispartofInternational Journal of Fractureen_US
dc.titleAnalytical solution for mode I crack orthogonal to free surfaceen_US
dc.typejournal articleen_US
dc.identifier.doi10.1007/BF00034031-
dc.contributor.affiliationSchool of Computing and Information Sciencesen_US
dc.relation.issn1573-2673en_US
dc.description.volume76en_US
dc.description.issue1en_US
dc.description.startpage79en_US
dc.description.endpage95en_US
dc.cihe.affiliatedNo-
item.openairecristypehttp://purl.org/coar/resource_type/c_6501-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.languageiso639-1en-
item.openairetypejournal article-
item.fulltextNo Fulltext-
crisitem.author.deptSchool of Computing and Information Sciences-
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