Please use this identifier to cite or link to this item:
https://repository.cihe.edu.hk/jspui/handle/cihe/3045
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Leung, Andrew Yee Tak | en_US |
dc.contributor.other | Tsang, K. L. | - |
dc.date.accessioned | 2022-04-13T04:08:00Z | - |
dc.date.available | 2022-04-13T04:08:00Z | - |
dc.date.issued | 2000 | - |
dc.identifier.uri | https://repository.cihe.edu.hk/jspui/handle/cihe/3045 | - |
dc.description.abstract | The fractal two-level finite element method has been proved to be very efficient and accurate for determining the stress intensity factor (SIF) for mode I and mode II two-dimensional crack problem. One main reason is that the method does not require new finite element and can be implemented easily with existing commercial packages. In this paper we extend the two-level finite element method to mode III (out of plane deformation) two-dimensional crack. Accurate determination of SIF will be demonstrated and results will be compared with the literature. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Springer | en_US |
dc.relation.ispartof | International Journal of Fracture | en_US |
dc.title | Mode III two-dimensional crack problem by two-level finite element method | en_US |
dc.type | journal article | en_US |
dc.identifier.doi | 10.1023/A:1007636810404 | - |
dc.contributor.affiliation | School of Computing and Information Sciences | en_US |
dc.relation.issn | 1573-2673 | en_US |
dc.description.volume | 102 | en_US |
dc.description.issue | 3 | - |
dc.description.startpage | 245 | en_US |
dc.description.endpage | 258 | en_US |
dc.cihe.affiliated | No | - |
item.fulltext | No Fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.languageiso639-1 | en | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Yam Pak Charitable Foundation School of Computing and Information Sciences | - |
Appears in Collections: | CIS Publication |
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