Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/2934
DC FieldValueLanguage
dc.contributor.authorChan, Anthony Hing-Hungen_US
dc.contributor.otherRiaz, A.-
dc.date.accessioned2022-04-06T06:16:10Z-
dc.date.available2022-04-06T06:16:10Z-
dc.date.issued2003-
dc.identifier.urihttps://repository.cihe.edu.hk/jspui/handle/cihe/2934-
dc.description.abstractA handheld set implementation using a wireless VoIP protocol is an inexpensive and effective solution to cellular phones. Although network to network interface has already been implemented using VoIP, the bottle-neck for wireless network is usually at the wireless access interface. Extending the use of IP packet to the edge benefits companies with cost management and effectively raise its customer base. A VoIP implemented in a handheld phone will deliver a more robust solution of VoIP from user to end user interface. Implementation of a handheld wireless VoIP handheld set needs new hardware. Functionality in wireless chipsets has been divided between MAC/DSP/RF layers. The medium access controller (MAC) layer serves as the media information interface and controller. The wireless VoIP custom chip in this design integrates those functionalities to implement the handheld wireless VoIP handset. The Physical layer includes the base-band signal processing functions and the RF front-end circuitry, provides the necessary filtering and variable gain, and signal converter functions. With the MAC and base-band DSP functions at the back-end of the physical layer having been fully digitized, these functions may be integrated onto a single digital chip. Vendors then provide the front-end physical layer functions, RF and analogue circuits on RF chips, usually incorporating minimal digital functionality while the back end of the functions can be implemented more efficiently using the DSP technology.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.titleWireless VoIP phone architecture and hardware requirementsen_US
dc.typeconference proceedingsen_US
dc.relation.publicationProceedings of the 29th Annual Conference of the IEEE Industrial Electronics Society (IECON 2003) Vol. 3en_US
dc.identifier.doi10.1109/IECON.2003.1280674-
dc.contributor.affiliationSchool of Computing and Information Sciencesen_US
dc.relation.isbn0780379063en_US
dc.description.startpage2699en_US
dc.description.endpage2704en_US
dc.cihe.affiliatedNo-
item.openairecristypehttp://purl.org/coar/resource_type/c_5794-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.languageiso639-1en-
item.openairetypeconference proceedings-
item.fulltextNo Fulltext-
crisitem.author.deptSchool of Computing and Information Sciences-
crisitem.author.orcid0000-0001-7479-0787-
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