Please use this identifier to cite or link to this item: https://repository.cihe.edu.hk/jspui/handle/cihe/2415
DC FieldValueLanguage
dc.contributor.authorLeung, Andrew Yee Taken_US
dc.contributor.otherZhou, Z.-H.-
dc.contributor.otherXu, X.-S.-
dc.contributor.otherGuan, Z.-Q.-
dc.date.accessioned2022-03-01T04:11:25Z-
dc.date.available2022-03-01T04:11:25Z-
dc.date.issued2011-
dc.identifier.urihttps://repository.cihe.edu.hk/jspui/handle/cihe/2415-
dc.description.abstractStress intensity factors are analytically derived for an edge-cracked circular disk subjected to transient thermal stresses using symplectic technique. The transient temperature function for the time independent boundary conditions is obtained by a generalized symplectic approach and the method of separation of variables. From the obtained temperature function, quasi-static solutions of the thermoelasticity problem are derived analytically. The stress intensity factors together with the close form solutions for both displacements and stresses are found simultaneously. The results obtained are in good accordance with those cited in the literature for some special cases of steady state problem. In addition, a parametric study is performed in the numerical examples.en_US
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.relation.ispartofNuclear Engineering and Designen_US
dc.titleTransient thermal stress intensity factors for Mode I edge-cracksen_US
dc.typejournal articleen_US
dc.identifier.doi10.1016/j.nucengdes.2011.07.034-
dc.contributor.affiliationSchool of Computing and Information Sciencesen_US
dc.relation.issn0029-5493en_US
dc.description.volume241en_US
dc.description.issue9en_US
dc.description.startpage3613en_US
dc.description.endpage3623en_US
dc.cihe.affiliatedNo-
item.languageiso639-1en-
item.fulltextNo Fulltext-
item.openairetypejournal article-
item.grantfulltextnone-
item.openairecristypehttp://purl.org/coar/resource_type/c_6501-
item.cerifentitytypePublications-
crisitem.author.deptYam Pak Charitable Foundation School of Computing and Information Sciences-
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